Non-destructive in situ test for anodic bonding
- 31 May 1997
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 60 (1-3) , 176-180
- https://doi.org/10.1016/s0924-4247(96)01434-3
Abstract
No abstract availableKeywords
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- A bulk silicon dissolved wafer process for microelectromechanical devicesJournal of Microelectromechanical Systems, 1992
- Precision accelerometers with μg resolutionSensors and Actuators A: Physical, 1990
- Anodic bonding of imperfect surfacesJournal of Applied Physics, 1983