Degradation of Thermocompression Bonds to Ti-Cu-Au and Ti-Cu Thin Films by Thermal Aging
- 1 March 1980
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 3 (1) , 134-143
- https://doi.org/10.1109/tchmt.1980.1135575
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
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- A formalism for determining grain boundary diffusion coefficients using surface analysisSurface Science, 1976
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- Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated AgingIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- Mass diffusion in polycrystalline copper/electroplated gold planar couplesMetallurgical Transactions, 1972
- On the porosity observed in the Kirkendall effectActa Metallurgica, 1953