Interconnection System Requirements and Modeling
- 8 July 1987
- journal article
- website
- Published by Institute of Electrical and Electronics Engineers (IEEE) in AT&T Technical Journal
- Vol. 66 (4) , 45-56
- https://doi.org/10.1002/j.1538-7305.1987.tb00217.x
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Report: Systems PackagingAT&T Technical Journal, 1987
- Interconnection MediaAT&T Technical Journal, 1987
- The DIP may take its final bows: The dual-in-line package, the reigning IC package for several generations, is losing position to newcomers for packaging advanced chipsIEEE Spectrum, 1985
- Functional Cycles and Surface Mounting Attachment ReliabilityCircuit World, 1985
- High Pinout IC Packaging and the Density Advantage of Surface MountingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983