The design and properties of new, Pb-free solder alloys
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- New Pb-free solder alloy with superior mechanical propertiesApplied Physics Letters, 1993
- Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling RatesJournal of Electronic Packaging, 1992
- The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder JointsPublished by Springer Nature ,1991