Chip Bonding on Non-rigid and Flexible Substrates with New Stepped Processes

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Abstract
Reliable interconnection of electrodes to the plastic-based display with anisotropic conductive films (ACFs), of which the conductive particles were similar in elasticity to the substrates, was accomplished. The contact resistance value was maintained even while the junction was stressed under sudden changes in temperature and pressure. It was found that the conduction failure was caused by the action of a complex mechanism on the changes of a joint structure. The major driving factor seems likely to be defects in the transparent electrodes due to the thermal strain of substrates and penetration of conductive particles. Conductive particles with elasticity similar to that of the plastic substrates did little damage to the transparent electrodes on the substrates, and low temperature and pressure under a stepped process did not bring about their deformation either. As a result, a highly reliable interconnect with a very low contact resistance was realized.

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