A fine pitch COG technique for a TFT-LCD panel using an indium alloy
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (8) , 852-857
- https://doi.org/10.1109/33.273684
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
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- A new face down bonding technique using a low melting point metalIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- A new LSI bonding technology 'Micron bump bonding assembly technology'Published by Institute of Electrical and Electronics Engineers (IEEE) ,1988