A new face down bonding technique using a low melting point metal
- 1 June 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (2) , 444-447
- https://doi.org/10.1109/33.56182
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- A new LSI bonding technology 'Micron bump bonding assembly technology'Published by Institute of Electrical and Electronics Engineers (IEEE) ,1988