Surface-mount plastic packages-an assessment of their thermal performance
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 745-752
- https://doi.org/10.1109/33.49042
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Package thermal resistance model dependency on equipment designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Parametric Study of Heatspreader Thermal Performance in 48 Lead Plastic DIP's and 68 Lead Plastic Leaded Chip CarriersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
- Thermal Characteristics of Plastic Small Outline Transistor (SOT) PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
- Thermal Characteristics of 16- and 40-Pin Plastic DIP'sIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981