Parametric Study of Heatspreader Thermal Performance in 48 Lead Plastic DIP's and 68 Lead Plastic Leaded Chip Carriers
- 1 December 1986
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 9 (4) , 347-352
- https://doi.org/10.1109/tchmt.1986.1136690
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Thermal management in semiconductor device packagingProceedings of the IEEE, 1985
- Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic CircuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- VLSI Thermal Management in Cost Driven SystemsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982
- Thermal Characteristics of 16- and 40-Pin Plastic DIP'sIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- Thermal Resistance: A Reliability ConsiderationIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980