Solder Joint Reliability of Leadless Chip Carriers

This publication has 4 references indexed in Scilit:

• The Characterisation of Novel PWB Substrate Materials for Leadless Ceramic Chip Carrier Attachment
  Microelectronics International, 1986
• Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,1985
• The Measurement of Flux Residues from Chip Carrier Attachment and Their Effect On Other Thick Film Hybrid Components
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
• The Effect of High Dissipation Components on the Solder Joints of Ceramic Chip Carriers Attached to Thick Film Alumina Substrates
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983