An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder
- 11 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Microstructure evolution of eutectic Sn-Ag solder jointsJournal of Electronic Materials, 1994
- Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysisJournal of Electronic Materials, 1994