Direct Attachment of Leadless Chip Carriers to Organic Matrix Printed Wiring Boards
- 1 September 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (3) , 227-231
- https://doi.org/10.1109/tchmt.1983.1136193
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Low Expansivity Organic Substrate for Flip-Chip BondingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979