The influence of copper nanopowders on microstructure and hardness of lead–tin solder
- 8 March 2002
- journal article
- research article
- Published by Elsevier in Materials Letters
- Vol. 53 (4-5) , 333-338
- https://doi.org/10.1016/s0167-577x(01)00503-1
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Hard‐particle Reinforced Composite Solders Part 1: MicrocharacterisationSoldering & Surface Mount Technology, 1997
- A Mössbauer Study of Tin-Based Intermetallics Formed During the Manufacture of Dispersion-Strengthened Composite SoldersJournal of Electronic Materials, 1997
- The formation and growth of intermetallics in composite solderJournal of Electronic Materials, 1993
- Composite soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991