Mechanical behavior of aluminum and Al-Cu(2%) thin films
- 1 December 1988
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 166, 291-298
- https://doi.org/10.1016/0040-6090(88)90390-2
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
- Mechanical properties and microstructures of Al-1%Si thin film metallizationsThin Solid Films, 1987
- Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniquesJournal of Materials Research, 1986
- Hall-petch relation in thin film metallizationsScripta Metallurgica, 1986
- Recent developments in the study of mechanical properties of thin filmsThin Solid Films, 1972
- Stress and Strain in Thin Films Bulged over Circular OpeningsJournal of Applied Physics, 1961
- Mechanical Properties of Thin Single-Crystal Gold FilmsJournal of Applied Physics, 1960
- Activation energies for creep of high-purity aluminumActa Metallurgica, 1957
- Theory of Steady-State Creep Based on Dislocation ClimbJournal of Applied Physics, 1955