Stress-related effects in thin films
- 1 April 1989
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 171 (1) , 5-31
- https://doi.org/10.1016/0040-6090(89)90030-8
Abstract
No abstract availableThis publication has 30 references indexed in Scilit:
- Effect of heat treatment after deposition on internal stress in molybdenum films on SiO2/Si substratesJournal of Vacuum Science and Technology, 1977
- Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputteringJournal of Vacuum Science and Technology, 1977
- Stresses in thin films: The relevance of grain boundaries and impuritiesThin Solid Films, 1976
- Argon entrapment in metal films by dc triode sputteringJournal of Applied Physics, 1975
- A model of deadherence due to stresses in an elastic filmJournal of Physics D: Applied Physics, 1972
- Stress Relief and Hillock Formation in Thin Lead FilmsJournal of Applied Physics, 1970
- Argon Concentration in Tungsten Films Deposited by dc SputteringJournal of Vacuum Science and Technology, 1970
- Intrinsic Stress in Evaporated Metal FilmsJournal of the Electrochemical Society, 1968
- THE IONIC ENTRAPMENT AND THERMAL DESORPTION OF INERT GASES IN TUNGSTEN FOR KINETIC ENERGIES OF 40 EV TO 5 KEVCanadian Journal of Physics, 1964
- Reflection of Noble Gas Ions at Solid SurfacesPhysical Review B, 1961