Electrical evaluation of flip-chip package alternatives for next generation microprocessors
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Importance of damping and resonance in thin-film integrated decoupling capacitor designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Measurement, modeling, and simulation of flip-chip CMOS ASIC simultaneous switching noise on a multilayer ceramic BGAIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1997