Influence of initial wafer cleanliness on metal removal efficiency in immersion SC-1 cleaning: limitation of immersion-type wet cleaning
- 1 January 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Semiconductor Manufacturing
- Vol. 11 (1) , 20-24
- https://doi.org/10.1109/66.661280
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Detection of 30–40-nm Particles on Bulk-Silicon and SOI Wafers Using Deep UV Laser ScatteringIEEE Transactions on Semiconductor Manufacturing, 2006
- Influence Of Particles/Impurity Metals In RCA Cleaning Solutions On Surface Contamination.Published by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Identification and Removal of Trace Organic Contamination on Silicon Wafers Stared in Plastic BoxesJournal of the Electrochemical Society, 1996
- Adsorption and Desorption of Metallic Impurities on Si Wafer Surface in SC1 SolutionJapanese Journal of Applied Physics, 1992