Low cost molded packaging for optical data links
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 312-316
- https://doi.org/10.1109/ectc.1994.367572
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Physical design and performance of optical data-link packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Use of low cost plastic DIPs and injection molded parts in packaging of optical data linksPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003