Crisis in technology: the questionable US ability to manufacture thin-film multichip modules
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Proceedings of the IEEE
- Vol. 80 (12) , 1995-2002
- https://doi.org/10.1109/5.192077
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- High-performance VLSI through package-level interconnectsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Applications of multichip modules for high speed communications interfacesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003