Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers
- 1 May 2000
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 82 (1-3) , 224-228
- https://doi.org/10.1016/s0924-4247(99)00376-3
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Low temperature bonding for microfabrication of chemical analysis devicesSensors and Actuators B: Chemical, 1997
- System peaks in capillary zone electrophoresis: II. Experimental study of vacancy peaksJournal of Chromatography A, 1997
- Examination of glass-silicon and glass-glass bonding techniques for microfluidic systemsPublished by SPIE-Intl Soc Optical Eng ,1995
- Anodic bonding of silicon to silicon wafers coated with aluminium, silicon oxide, polysilicon or silicon nitrideSensors and Actuators A: Physical, 1993
- Bonding of silicon wafers for silicon-on-insulatorJournal of Applied Physics, 1988