Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization
- 1 October 2000
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1170-1174
- https://doi.org/10.1007/s11664-000-0009-4
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- The Au-Pb-Sn ternary systemJournal of the Less Common Metals, 1967