Board level drop test reliability of IC packages
- 28 July 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Finite element modeling of CSP package subjected to board level drop testPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Effect of thermal aging on board level drop reliability for Pb-free BGA packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Drop impact test - mechanics & physics of failurePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Impact MechanicsPublished by Cambridge University Press (CUP) ,2000