Finite element modeling of CSP package subjected to board level drop test
- 21 March 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Mechanical response of PCBs in portable electronic products during drop impactPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
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