Modeling and simulation of printed circuit board drop test
- 23 April 2004
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Modeling and simulation of drop tests for printed circuit boards (PCB) was conducted for flip chip on board (FCOB) assemblies. The PCB test vehicle has dimensions of 185 mm by 150 mm with 6 large flip chips (8 mm/spl times/8 mm) and 6 small flip chips (3 mm/spl times/3 mm) mounted with underfill encapsulation. The PCB specimen was clamped at two edges on a test fixture and mounted on the drop test machine platform. A drop height of 1.0 m was used for repeated drop tests. In this study, finite element analysis (FEA) of the drop test for the PCB specimen was modeled using the Pam-Crash software. Dynamic modeling and simulation of the drop test sequence of events was established. The modeling approach employs the experimentally measured displacement history (from the high speed camera) at the clamp edges of the PCB as inputs to the local model analysis to compute the displacement and acceleration. The FEA modeling and simulation results show that the predicted displacements and accelerations at selected locations on the PCB agreed satisfactorily with the measured results.Keywords
This publication has 8 references indexed in Scilit:
- Drop impact survey of portable electronic productsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Mechanical response of PCBs in portable electronic products during drop impactPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Performance of lead-free solder joints under dynamic mechanical loadingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Dynamic behavior of electronics package and impact reliability of BGA solder jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Drop/impact simulation and test validation of telecommunication productsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Could Shock Tests Adequately Mimic Drop Test Conditions?Journal of Electronic Packaging, 2002
- Vibration analysis of medical devices with a calibrated FEA modelComputers & Structures, 2002
- Effect of the drop impact on BGA/CSP package reliabilityMicroelectronics Reliability, 2002