Performance of lead-free solder joints under dynamic mechanical loading

Publisher Website

25 June 2003

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/ectc.2002.1008267

Abstract

No abstract available

Keywords

This publication has 4 references indexed in Scilit:

Lead‐free reflow soldering for electronics assembly
Soldering & Surface Mount Technology, 2001
Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints
Microelectronics Reliability, 2001
Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders
MATERIALS TRANSACTIONS, 2001
Evaluation of Pb-free solders for adaptability to various soldering processes
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1999