Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders
- 1 January 2001
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 42 (5) , 794-802
- https://doi.org/10.2320/matertrans.42.794
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrateJournal of Electronic Materials, 2000
- Lead-free Solders in MicroelectronicsMaterials Science and Engineering: R: Reports, 2000