Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
- 1 October 2000
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1207-1213
- https://doi.org/10.1007/s11664-000-0014-7
Abstract
No abstract availableKeywords
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