Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation
- 1 May 1997
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 45 (5) , 1867-1874
- https://doi.org/10.1016/s1359-6454(96)00325-4
Abstract
No abstract availableKeywords
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