Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology
- 23 July 2001
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 79 (4) , 482-484
- https://doi.org/10.1063/1.1388160
Abstract
The relationship between the microstructure and the mechanical tensile properties of lead-free solders and eutectic SnPb solders is presented for flip chip scale interconnects. Eutectic Sn–37Pb and Sn–0.7Cu solder (in wt %) exhibited a ductile fracture after tensile testing. Eutectic Sn–3.5Ag solder (in wt %) had greater strength and exhibited a brittle fracture at the interface. The different fracture behavior of the lead-free solders was attributed to the grain size and configuration of the intermetallics. Minor additions of alloying elements to the high Sn lead-free solder dramatically affected the microstructure and mechanical properties.Keywords
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