Interstitial defects in silicon from 1–5 keV Si+ ion implantation

Extended defects from 5-, 2-, and 1-keV ${\mathrm{Si}}^{+}$ ion implantation are investigated by transmission electron microscopy using implantation doses of 1 and ${\text{3×10}}^{14}\hspace{0.17em}{\mathrm{cm}}^{\mathrm{-2}}$ and annealing temperatures from 750 to 900 °C. Despite the proximity of the surface, {311}-type defects are observed even for 1 keV. Samples with a peak concentration of excess interstitials exceeding ∼1% of the atomic density also contain some {311} defects which are corrugated across their width. These so-called zig-zag {311} defects are more stable than the ordinary {311} defects, having a dissolution rate at 750 °C which is ten times smaller. Due to their enhanced stability, the zig-zag {311} defects grow to lengths that are many times longer than their distance from the surface. It is proposed that zig-zag {311} defects form during the early stages of annealing by coalescence the high volume density of {311} defects confined within a very narrow implanted layer. These findings indicate that defect formation and dissolution will continue to control the interstitial supersaturation from ion implantation down to very low energies.