Modeling electromigration-induced stress evolution in confined metal lines
- 15 July 1995
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 78 (2) , 900-904
- https://doi.org/10.1063/1.360281
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- Stress and electromigration in Al-lines of integrated circuitsPublished by Elsevier ,2003
- The finite electromigration boundary value problemJournal of Materials Research, 1994
- Stress evolution due to electromigration in confined metal linesJournal of Applied Physics, 1993
- Numerical investigations of the electromigration boundary value problemJournal of Applied Physics, 1992
- A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2Journal of Applied Physics, 1986
- The effect of passivation thickness on the electromigration lifetime of Al/Cu thin film conductorsJournal of Vacuum Science & Technology A, 1983
- Electromigration in thin aluminum films on titanium nitrideJournal of Applied Physics, 1976
- Void Formation and Growth During Electromigration in Thin FilmsJournal of Applied Physics, 1971
- Reply to “The driving force for diffusion”Scripta Metallurgica, 1971
- Diffusional Viscosity of a Polycrystalline SolidJournal of Applied Physics, 1950