Adhesion Measurement of Interfaces in Multilayer Interconnect Structures

This publication has 10 references indexed in Scilit:

• A four-point bending technique for studying subcritical crack growth in thin films and at interfaces
  Journal of Materials Research, 1997
• Measurement of the Fracture Energy of SiO2/TiN Interfaces Using the Residually-Stressed Thin-Film Micro-Strip Test
  MRS Proceedings, 1996
• Deoxidization of Water Desorbed from APCVD TEOS-O3 SiO2 by Titanium Cap Layer
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,1995
• Toughness of an interface along a thin ductile layer joining elastic solids
  Philosophical Magazine A, 1994
• A theory for cleavage cracking in the presence of plastic flow
  Acta Metallurgica et Materialia, 1993
• Metal-ceramic interfacial fracture resistance using the continuous microscratch technique
  Thin Solid Films, 1993
• A review of the methods for the evaluation of coating-substrate adhesion
  Materials Science and Engineering: A, 1991
• Mixed Mode Cracking in Layered Materials
  Published by Elsevier ,1991
• A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces
  Journal of Applied Mechanics, 1989
• Moisture assisted crack growth in ceramics
  International Journal of Fracture, 1968