Metal-ceramic interfacial fracture resistance using the continuous microscratch technique
- 1 February 1993
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 223 (2) , 269-275
- https://doi.org/10.1016/0040-6090(93)90532-t
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- Microscratch analysis of the work of adhesion for Pt thin films on NiOJournal of Materials Research, 1992
- The effect of the interfacial strength on the mechanical properties of aluminum filmsThin Solid Films, 1990
- Effect of residual stress and adhesion on the hardness of copper films deposited on siliconJournal of Materials Research, 1990
- Microhardness and microstructure of ion-beam-sputtered, nitrogen-doped NiFe filmsThin Solid Films, 1988
- Adhesion testing by the scratch test method: The influence of intrinsic and extrinsic parameters on the critical loadThin Solid Films, 1987
- A model for stress-induced metal notching and voiding in very large-scale-integrated Al–Si (1%) metallizationJournal of Vacuum Science & Technology B, 1987
- Scratch Adhesion Testing: A CritiqueSurface Engineering, 1986
- Scratch adhesion testing of hard coatingsThin Solid Films, 1983
- New method of detecting contact between floating-head and diskIEEE Transactions on Magnetics, 1980
- Gold-to-alumina solid state reaction bondingJournal of Materials Science, 1978