Resistivity and microstructure of polycrystalline Au films deposited by rf bias-diode and triode sputtering
- 1 July 1978
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 49 (7) , 4094-4097
- https://doi.org/10.1063/1.325370
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Nucleation and growth of rf triode-sputtered gold filmsJournal of Vacuum Science and Technology, 1975
- Electrical and optical properties of rf triode-sputtered Au filmsJournal of Vacuum Science and Technology, 1974
- Desorptionsspektren und Adsorptionszustände im System Nickel/WasserstoffBerichte der Bunsengesellschaft für physikalische Chemie, 1970
- Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External SurfacesPhysical Review B, 1970
- Resistivity and Structure of Evaporated Aluminum FilmsJournal of Vacuum Science and Technology, 1969
- The effect of grain boundaries on the electrical resistivity of polycrystalline copper and aluminiumPhilosophical Magazine, 1969
- Variations avec la température de la résistivité des couches minces d'orSurface Science, 1967
- Anomalous Skin Effect in BismuthPhysical Review B, 1959
- The mean free path of electrons in metalsAdvances in Physics, 1952