Characterization of electroless deposited Co(W,P) thin films for encapsulation of copper metallization
- 15 April 2001
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 302 (1) , 18-25
- https://doi.org/10.1016/s0921-5093(00)01348-4
Abstract
No abstract availableKeywords
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