Thermal Interactions Between Electromigration Test Structures
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Reproducibility of electromigration measurementsIEEE Transactions on Electron Devices, 1987
- Electromigration and the Current Density Dependence8th Reliability Physics Symposium, 1985
- Electromigration of Al-Si Alloy Films8th Reliability Physics Symposium, 1978
- Thermal conductivity variation of silicon with temperatureMicroelectronics Reliability, 1978