Structure and electrical properties of thin copper films deposited by MOCVD
- 1 October 1995
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 91 (1-4) , 134-138
- https://doi.org/10.1016/0169-4332(95)00108-5
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
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- A new metal-organic chemical vapor deposition process for selective copper metallizationMaterials Science and Engineering: B, 1993
- Double-level copper interconnections using selective copper CVDJournal of Electronic Materials, 1992