The effect of high d.c. density stressing on pre-existing voids in thin gold films
- 1 November 1979
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 64 (1) , 163-169
- https://doi.org/10.1016/0040-6090(79)90555-8
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- The effect of minor constituents on the electrotransport-induced failure site in thin gold filmsApplied Physics Letters, 1978
- Void growth in the early stages of aging and electromigrationJournal of Applied Physics, 1977
- Low temperature void growth and resistivity decay in thin evaporated gold filmsThin Solid Films, 1977
- Voids in thin as‐deposited gold films prepared by vapor depositionJournal of Vacuum Science and Technology, 1977
- Grain coarsening and gas bubbles in annealed gold filmsPhilosophical Magazine, 1975
- Nucleation of voids and their growth during electromigrationJournal of Applied Physics, 1973
- Electromigration and crevice formation in thin metallic filmsThin Solid Films, 1972
- Electromigration Damage in Thin Films due to Grain Boundary Grooving ProcessesJournal of Applied Physics, 1971
- Time-dependent void nucleation during electromigrationMaterials Science and Engineering, 1971
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969