Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
- 28 July 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2 (05695503) , 622-629
- https://doi.org/10.1109/ectc.2005.1441334
Abstract
No abstract availableThis publication has 18 references indexed in Scilit:
- Study of intermetallic growth on PWBs soldered with Sn/sub 3.0/Ag/sub 0.5/CuPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Effect of intermetallic phases on performance in a mechanical drop environment: 96.5Sn3.5Ag solder on Cu and Ni/Au pad finishesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- High drop test reliability: lead-free soldersPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Effect of thermal aging on board level drop reliability for Pb-free BGA packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Formation and growth kinetics of interfacial intermetallics in Pb-free solder jointIEEE Transactions on Components and Packaging Technologies, 2003
- Intermetallic growth on PWBs soldered with Sn3.8Ag0.7CuPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Interfacial reaction studies on lead (Pb)-free solder alloysIEEE Transactions on Electronics Packaging Manufacturing, 2002
- Effect of PCB finish on the reliability and wettability of ball grid array packagesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Dynamic Behavior of MaterialsPublished by Wiley ,1994