Thin-film encapsulation of organic light-emitting devices
Top Cited Papers
- 24 May 2005
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 86 (22)
- https://doi.org/10.1063/1.1929867
Abstract
Organic light-emitting devices (OLED) are extremely sensitive to moisture and oxygen. Without high-performance hermetic seals, the life of these devices is limited. Bottom-emitter OLEDs are commonly sealed using epoxy and cover glass with large amounts of desiccant. In top-emitter OLEDs the light passes through the cover glass on which the desiccant typically resides. Thus, transparent thin-film encapsulation without any desiccant is most desirable. This paper reports the results of a robust thin-film encapsulation method that utilizes a layer of aluminum oxide deposited by atomic layer deposition (ALD) process as the primary moisture barrier. More than 1000 h in 85 °C and 85% RH testing has been observed without significant device degradation caused by moisture. Data corroborating this method's superiority over other physical deposition methods for OLED encapsulation are also presented.Keywords
This publication has 5 references indexed in Scilit:
- Formation and growth of black spots in organic light-emitting diodesJournal of Applied Physics, 1996
- Calculations of electron inelastic mean free paths. III. Data for 15 inorganic compounds over the 50–2000 eV rangeSurface and Interface Analysis, 1991
- Organic electroluminescent diodesApplied Physics Letters, 1987
- Stability of rf-sputtered aluminum oxideJournal of Vacuum Science and Technology, 1977
- Solid state—and surface—analysis by means oF angular-dependent x-ray photoelectron spectroscopyProgress in Solid State Chemistry, 1976