Strain-relaxation in thin films on substrates
- 28 February 1974
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 22 (2) , 177-183
- https://doi.org/10.1016/0001-6160(74)90008-x
Abstract
No abstract availableThis publication has 31 references indexed in Scilit:
- Annealing behavior of electroplated permalloy thin filmsJournal of Electronic Materials, 1973
- The origins of stress in thin nickel filmsThin Solid Films, 1972
- The Structure of Electroplated and Vapor-Deposited Copper FilmsJournal of Applied Physics, 1972
- Internal StressesJournal of Vacuum Science and Technology, 1969
- Stress in Vacuum-Deposited Films of Ag, Au, and CuJournal of Vacuum Science and Technology, 1969
- Mechanisms of Stress Relief in Thin FilmsJournal of Vacuum Science and Technology, 1969
- Intrinsic Stress in Evaporated Metal FilmsJournal of Vacuum Science and Technology, 1969
- Some measurements of stress in thin films prepared by low pressure triode sputteringVacuum, 1969
- The nucleation, growth, structure and epitaxy of thin surface filmsAdvances in Physics, 1965
- A study of growth defects in face-centred cubic metal foils prepared by evaporationPhilosophical Magazine, 1959