Pulse plating
- 31 August 1990
- journal article
- review article
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 25 (5) , 439-461
- https://doi.org/10.1016/0254-0584(90)90111-m
Abstract
No abstract availableKeywords
This publication has 59 references indexed in Scilit:
- Fundamental aspects of pulsating current metal electrodeposition IX: The prevention of spongy deposit formation on inert substratesSurface Technology, 1984
- Fundamental aspects of pulsating current metal electrodeposition VIII: The effect of pause-to-pulse ratio on microthrowing power of metal depositionSurface Technology, 1984
- Electrolytic aluminium plating in molten salt mixtures based on AlCl3 II: Influences of the application of the pulsed current and of a copper underlayerSurface Technology, 1982
- Fundamental aspects of pulsating current metal electrodeposition IV: Tafel equation in the deposition of metals by a pulsating currentSurface Technology, 1982
- Fundamental aspects of pulsating current metal electrodeposition III: Maximum practical deposition rateSurface Technology, 1981
- Electrocrystallization in pulse electrolysisSurface Technology, 1978
- Formation of powdered copper deposits by square-wave pulsating overpotentialJournal of Applied Electrochemistry, 1977
- Electrodeposition of Gold by Pulsed CurrentJournal of the Electrochemical Society, 1971
- Controlled Current Deposition of Zinc from Alkaline SolutionJournal of the Electrochemical Society, 1969
- Charging the Silver Oxide Electrode with Periodically Varying CurrentJournal of the Electrochemical Society, 1966