Fundamental aspects of pulsating current metal electrodeposition VIII: The effect of pause-to-pulse ratio on microthrowing power of metal deposition
- 30 June 1984
- journal article
- Published by Elsevier in Surface Technology
- Vol. 22 (2) , 155-158
- https://doi.org/10.1016/0376-4583(84)90051-7
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Fundamental aspects of plating technology I: The determination of the optimum deposition current densitySurface Technology, 1983
- Fundamental aspects of pulsating current metal electrodeposition IV: Tafel equation in the deposition of metals by a pulsating currentSurface Technology, 1982
- A‐C Modulation of a Rotating Zinc Electrode in an Acid Zinc‐Chloride SolutionJournal of the Electrochemical Society, 1981
- Fundamental aspects of pulsating current metal electrodeposition II: The mechanism of metal film formation on an inert electrodeSurface Technology, 1980
- Fundamental aspects of pulsating current metal electrodeposition I: The effect of the pulsating current on the surface roughness and the porosity of metal depositsSurface Technology, 1980
- The mechanism of copper powder formation in potentiostatic depositionJournal of Applied Electrochemistry, 1980
- Electrocrystallization in pulse electrolysisSurface Technology, 1978
- Mathematical model and digital simulation of pulsating overpotential copper electrodepositionJournal of Applied Electrochemistry, 1976
- The effect of pulsating potential electrolysis on the porosity of metal depositsJournal of Applied Electrochemistry, 1976