CMOS multichip module test vehicle with TAB'd components
- 9 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 712-718
- https://doi.org/10.1109/ectc.1991.163958
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Accurate measurement of high-speed package and interconnect parasiticsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Multi chip modules for telecom applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002