Transmission line modelling and failure modes in power punch-through diodes
- 14 March 1985
- journal article
- Published by IOP Publishing in Journal of Physics D: Applied Physics
- Vol. 18 (3) , 497-505
- https://doi.org/10.1088/0022-3727/18/3/016
Abstract
The temperature rise in a punch-through diode operating under pulsed conditions has been calculated using the transmission line modeling (TLM) method. The results compare favourably with experimental measurements on devices tested to destruction. Failure is due to a second breakdown process.Keywords
This publication has 4 references indexed in Scilit:
- The calculation of temperature distribution in punch-through structures during pulsed operation using the transmission line modelling (TLM) methodJournal of Physics D: Applied Physics, 1982
- The Solution of Inhomogeneous Waveguide Problems Using a Transmission-Line MatrixIEEE Transactions on Microwave Theory and Techniques, 1974
- Application of the transmission-line-matrix method to homogeneous waveguides of arbitrary cross-sectionProceedings of the Institution of Electrical Engineers, 1972
- Numerical solution of 2-dimensional scattering problems using a transmission-line matrixProceedings of the Institution of Electrical Engineers, 1971