Stress relaxation in 60Sn-40Pb solder joints
- 1 September 1988
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 17 (5) , 387-390
- https://doi.org/10.1007/bf02652123
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solderJournal of Electronic Materials, 1987
- An evaluation of the roles of intercrystalline and interphase boundary sliding in two-phase superplastic alloysActa Metallurgica, 1982
- Experimental constitutive relations for the high temperature deformation of a PbSn eutectic alloyMaterials Science and Engineering, 1981
- Stress relaxation in superplastic materialsJournal of Materials Science, 1973