Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

Publisher Website

30 August 2005

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 356-357
https://doi.org/10.1109/isscc.2005.1494016

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Low-temperature oxide-bonded three-dimensional integrated circuits
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
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