Studies of platinum electroplating baths Part IV: Deposits on copper from Q bath
- 1 August 1996
- journal article
- Published by Springer Nature in Journal of Applied Electrochemistry
- Vol. 26 (8) , 873-880
- https://doi.org/10.1007/bf00683750
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Studies of platinum electroplating baths Part III. The electrochemistry of Pt(NH3)4 − x(H2O)2+2 and PtCl4 − x(H2O)(2 − x)−xJournal of Electroanalytical Chemistry, 1995
- Studies of platinum electroplating baths Part I: The chemistry of a platinum tetrammine bathJournal of Applied Electrochemistry, 1992
- Improvements in Platinum PlatingPlatinum Metals Review, 1989