Compensation from implantation damage in InP

Abstract
Compensation arising from ion damage has been investigated in InP. It is found that ≳10 times the irradiation that produces resistive layers in GaAs is required to similarly compensate InP. The damage anneals in two stages indicating that two distinct defects contribute to the carrier removal process. Partial annealing at ∼400 °C rather than at 500 °C as in GaAs is suggested as a means of producing low‐absorption highly resistive layers. From compensation considerations annealing to at least 550 °C will be required for dopant implantations if effective electrical utilization is to be achieved.