An integration algorithm for the temperature solution of the four-layer infinite plate structure
- 1 January 1989
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
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This publication has 5 references indexed in Scilit:
- Thermal design of integrated circuit devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Exact thermal representation of multilayer rectangular structures by infinite plate structures using the method of imagesJournal of Applied Physics, 1988
- Real-time thermal design of integrated circuit devicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Thermal properties of the multilayer infinite plate structureJournal of Applied Physics, 1988
- The Thermal Design of an LSI Single-Chip PackageIEEE Transactions on Parts, Hybrids, and Packaging, 1976